Product laser
Products
Supports wafer sizes of wide range and thicknesses
Suitable for various substrates including sapphire, silicon, silicon carbide, lithium tantalate, and more
High positioning accuracy and repeatability
Excellent cutting quality with high straightness, no chipping or cracks
Minimal damage zone
| Laser Source | DPSS Laser | |
| Wafer Size | Support up to 12'' | |
| X-axis |
Travelling Range Moving Speed Resolution Positioning Accuracy |
310 mm 10 ~ 800 mm/s 100 nm ±5 μm |
| Y-axis |
Travelling Range Moving Speed Resolution Positioning Accuracy |
310 mm 10 ~ 800 mm/s 100 nm ±5 μm |
| Z-axis |
Resolution Positioning Accuracy |
100 nm ±2 μm |
| θ-axis | Max. Rotating Angle | 100 deg. |
