Product laser
Products
Industry-leading welding performance: maximum laser pull strength, minimal heat-affected zone, and low deformation during welding
Broad welding process compatibility: supports MBB and 0BB, printed silver grids and plated coatings, copper and aluminum ribbon; OBB also supports both flat and round ribbon types
Highly compatible automation line: enables fast switching among all module formats, accommodating changes in cell size, layout, ribbon specs, module structure, and assembly process
High yield across the entire line: equipped with single-cell PL, full-panel PL, 7-camera AOI, post-weld EL inspection, and fully automated repair for virtual solder and microcracks — ensuring zero microcrack, zero false weld, and zero short circuit
High system uptime: modular quick-swap design, auto ribbon feed & ultrasonic cleaning, independent-side operation during faults, enhancing operational efficiency and automation level
Strong scalability: optimized for thin-wafer processing, enables reduction of string spacing from 2 mm to 0.7 mm, increasing power generation area by 0.5%; supports optional upgrades for all-black modules, stacked negative-spacing layouts, and hidden busbar architectures
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Specification |
Details |
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Main Line Dimensions (L×W×H) |
60,000 mm × 3140 mm × 2800 mm |
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Compatible Cell Size |
160 × 160 mm to 210 × 210 mm |
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Compatible Cell Thickness |
110 μm to 200 μm |
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Number of Busbars |
10–24 BB |
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Compatible Glass Size (L×W) |
(1640 to 2600 mm) × (992 to 1400 mm) |
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Module Layout Compatibility |
Fully compatible with 54/60/66/72/78 cell formats |
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Overall Yield |
≥ 99.5% |
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Throughput |
≥ 5400 pcs/h @ 182 mm (equivalent to 3 GW/year per line) |
