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Ultrafast laser processing system combined with F-theta beam shaping and homogenization, enabling non-destructive ablation of oxide and passivation films

Customizable square beam spot sizes tailored to specific process requirements

Fine-pattern control technology ensures precise separation between P/N regions

In-house developed high-precision vision algorithms for accurate alignment

High throughput, high precision, high uniformity, and high stability

Multiple in-line inspection functions to ensure superior product yield

Modular design with strong compatibility and customizable configurations

Industry-leading welding performance: maximum laser pull strength, minimal heat-affected zone, and low deformation during welding

Broad welding process compatibility: supports MBB and 0BB, printed silver grids and plated coatings, copper and aluminum ribbon; OBB also supports both flat and round ribbon types

Highly compatible automation line: enables fast switching among all module formats, accommodating changes in cell size, layout, ribbon specs, module structure, and assembly process

High yield across the entire line: equipped with single-cell PL, full-panel PL, 7-camera AOI, post-weld EL inspection, and fully automated repair for virtual solder and microcracks — ensuring zero microcrack, zero false weld, and zero short circuit

High system uptime: modular quick-swap design, auto ribbon feed & ultrasonic cleaning, independent-side operation during faults, enhancing operational efficiency and automation level

Strong scalability: optimized for thin-wafer processing, enables reduction of string spacing from 2 mm to 0.7 mm, increasing power generation area by 0.5%; supports optional upgrades for all-black modules, stacked negative-spacing layouts, and hidden busbar architectures

Compact system footprint with single-sided operation and minimal space requirement

Dual-lane configuration (Line A & B) supports independent operation and fast switching between online/offline modes

Unique optical homogenization design enables full-surface scanning with large laser spots

Probe compression mode with zero shading; easy setup and high equipment utilization

Broad compatibility with various electrode patterns, including 0BB architecture

Simultaneous sintering of both front and rear electrodes

Built-in buffer zone prevents downtime during paste clogging; seamless loading/unloading transitions

Enables ultra-narrow line widths with 20%–50% paste savings

Adjustable aspect ratio from 10% to 80%, minimizing shading loss and boosting light-to-electricity conversion efficiency

High print consistency enhances electrical conductivity; compatible with low-temperature pastes

Non-contact, pressure-free printing significantly reduces breakage rate

Compatible with customized line patterns to maximize light reflection in lamination and increase module output

Supports a wide variety of advanced solar cell architectures

Designed for high-volume manufacturing with scalable output

Large-format high-precision gantry platform, capable of processing glass substrates up to 1600 × 1000 mm

Multi-stage substrate leveling mechanisms including floating clamps and glass hooks

Adaptive dust extraction system with synchronized airflow outlets for superior cleanliness during processing

High-speed processing with scribing speeds >1.5 m/s and 8–12 laser channels operating in parallel

Excellent process compatibility: customizable optics and processing schemes based on specific cell structures

Designed with customized laser and special circuit, it incorporates smart manufacturing technologies.

It adopts flexible graphic control modes, with multiple types of graphs, including points, lines, and dotted and solid lines.

It realizes 15-50μm ultra-thin line width, non-destructive ablation, automatic microscale positioning, and automatic full-domain correction.

It adopts F-T homogenization doping technology and laser pulse shaping technology to form a square spot

The system can be customized according to customer needs to achieve non-destructive, high-precision and high-efficiency laser doping, improve the conversion efficiency of PERC solar cells, and trigger the second round of technological upgrading of efficient solar cells

With laser high-precision graphics, it can achieve perfect overprinting effect with subsequent screen printing

The film is automatically cut by the knife, and the finished product is processed with zero waste

Loading and unrolling speed can be automatically adjusted according to the roll diameter to ensure the processing speed

The unrolling deviation can be automatically adjusted

Smooth cutting section, no microcrack, higher mechanical load strength;

The sample basically has no laser damage, no heat-affected zone, and low electrical performance loss;

Lower laser processing temperature and lower thermal damage;

Compatible with all kinds of solar cells:single-side or bifacial PERC,TOPCON, HIT and other solar cells.

The LIA process of HJT cell can be completed in a very short time, which provides a new solution for improving the efficiency of HJT cell

Compared with the traditional LED anti-light decay process equipment, this system has compact structure, high integration and small footprint