Product laser
Products
Ultrafast laser processing system combined with F-theta beam shaping and homogenization, enabling non-destructive ablation of oxide and passivation films
Customizable square beam spot sizes tailored to specific process requirements
Fine-pattern control technology ensures precise separation between P/N regions
In-house developed high-precision vision algorithms for accurate alignment
High throughput, high precision, high uniformity, and high stability
Multiple in-line inspection functions to ensure superior product yield
Modular design with strong compatibility and customizable configurations
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Specification |
Details |
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Equipment Dimensions (L×W×H) |
6000 mm × 4000 mm × 2200 mm |
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Compatible Wafer Size |
182 to 230 mm, supports various rectangular formats |
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Wafer Thickness Range |
100 to 180 μm |
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Loading/Unloading Mode |
AGV dual-layer dual-track system |
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Cassette Capacity |
5×2 + 1 + 1 |
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Throughput |
≥ 4000 pcs/h @ 182 mm × 182 mm |
