Product laser
Products
Compact system footprint with single-sided operation and minimal space requirement
Dual-lane configuration (Line A & B) supports independent operation and fast switching between online/offline modes
Unique optical homogenization design enables full-surface scanning with large laser spots
Probe compression mode with zero shading; easy setup and high equipment utilization
Broad compatibility with various electrode patterns, including 0BB architecture
Simultaneous sintering of both front and rear electrodes
Built-in buffer zone prevents downtime during paste clogging; seamless loading/unloading transitions
|
Specification |
Details |
|
Equipment Dimensions (L×W×H) |
3425 mm × 1250 mm × [Z-axis dimension unclear] |
|
Facility Space Requirement |
3500 mm × 3800 mm × 2500 mm |
|
Compatible Wafer Sizes |
182 to 210 mm |
|
Wafer Thickness Range |
120 to 180 μm |
|
Buffer System |
Stacked cassette trays |
|
Cassette Capacity |
(1 + 1) × 2 |
|
Uptime |
2464 hours/year (or as per defined uptime spec) |
|
Breakage Rate |
< 0.02% @182 mm wafer size |
|
Throughput |
>9600 pcs/hour (dual-lane) @182 mm |
